The E by DEK delivers E-Performance with:
With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.
Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.
If you would like to receive additional information, simply contact the E-Team.
| Machine Performance | Specification |
| Alignment | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
| System alignment capability | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
| Opyimum core cycle time | 8 seconds |
| Substrate size | 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
| Operating System | Windows 7 Embedded |
| Squeegee pressure mechanism | Software-controlled, motorized with closed loop feedback |
| Stencil positioning | Semi-auto stencil load with drip tray |
| Understencil cleaning | Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
| Adjustable-width stencil mount (AWSM) | Frame variants – fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
| Substrate thickness | 0.2 mm to 6 mm |
| Substrate weight (maximum) | 6 kg |
| Substrate warpage | Up to 7 mm including substrate thickness |
| Substrate fixture | Over the top clamps Edge clamps Foil-less clamps Vacuum |
| Temperature & humidity sensor | Monitoring of the process environment |
* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.
# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.
Turn E by DEK into a high – speed solution! With the right options, E by DEK takes your printing speed and throughput rate to new levels thanks to dual-speed motors, modern clamping and loading systems, and a whole lot more..
Features
E-Recommendation
For a more comprehensive production line suitable for various consumer electronic products, the E-Team recommends combining the E by DEK with E by SIPLACE machines equipped with our ‘Collect-and-Place 14’ and ‘Collect-and-Place 12 – Pick-and-Place’ heads.
The quality options for E by DEK was designed for all electronics manufacturers who want to optimize their paste application process for maximum print quality and stability.
Features
E-Recommendation
The E-Team recommends combining the E by DEK with our E by SIPLACE machine equipped with the ‘Collect-and-Place 12 – Pick-and-Place’ head for a more reliable and versatile production line.
Modules and flexible boards represent a major trend in electronics production. With the E by DEK you can be a player in this business. The Modules Pack ensures stable printing processes thanks to special tooling and clamping systems.
Features
E-Recommendation
The E-Team suggests pairing the E by DEK with our E by SIPLACE machine equipped with the ‘Collect & Place 14’ head for a fast and flexible production line.
The E by DEK opens up new opportunities by letting you transport and print boards with lengths of up to 620 millimeters.
Features
E-Recommendation
For a comprehensive mid-speed SMT line suitable for LED production, the E-Team recommends combining the E by DEK with our E by SIPLACE machine equipped with the ‘Collect-and-Place 12’ head.
E-Flexibility features:
With its E-Flexibility, the E by DEK makes the printing process easy and stable. Intuitive multi-language user interfaces, clamping systems for a wide range of stencil sizes and a modular design deliver maximum flexibility.
The quickest way to get to know the E by DEK: Move your mouse over the green E-Hotspots.
Learn about the strengths and special features of this unique printing solution and find out why the E by DEK sets new standards in quality, performance and ease of operation.
