DEK’s experienced printing specialists have developed an innovative platform for E by DEK with

  • High-quality components,
  • Sophisticated construction,
  • Modular design

that guarantees a stable and reliable printing process even for the latest fine-pitch applications.

The E by DEK delivers E-Performance with:

  • 8 seconds core cycle time
  • Fast setup changeovers
  • High repeatability

With the shortest cycle times and the fastest product changeovers paired with maximum repeat accuracy, the E by DEK sets new standards in the mid-speed segment.

The E by DEK
delivers E-Performance

Clearly structured, and each number provides a strong argument: The most important facts and figures on the E by DEK.
If you would like to receive additional information, simply contact the E-Team.

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Machine Performance Specification
Alignment > 2.0 Cmk @ ± 12.5 μm (± 6 sigma)
System alignment capability > 2.0 Cmk @ ± 25 μm (± 6 sigma)
Opyimum core cycle time 8 seconds
Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y)
Operating System Windows 7 Embedded
Squeegee pressure mechanism Software-controlled, motorized with closed loop feedback
Stencil positioning Semi-auto stencil load with drip tray
Understencil cleaning Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe
Adjustable-width stencil mount (AWSM) Frame variants – fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm
Substrate thickness 0.2 mm to 6 mm
Substrate weight (maximum) 6 kg
Substrate warpage Up to 7 mm including substrate thickness
Substrate fixture Over the top clamps
Edge clamps
Foil-less clamps
Vacuum
Temperature & humidity sensor Monitoring of the process environment

* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.

# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.

Flexibility at its best!
Each SMT factory has its own special challenges. That is why we have developed Options for the E by DEK that allow custom tuning with perfectly coordinated modules for printing results that will make your customers happy and raise your SMT production to a new level.

E by DEK Options for all your applications :

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Throughput

Turn E by DEK into a high - speed solution
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Turn E by DEK into a high – speed solution! With the right options, E by DEK takes your printing speed and throughput rate to new levels thanks to dual-speed motors, modern clamping and loading systems, and a whole lot more..
Features

  • 8s core cycle time
  • Dual-speed motor (DSM)

E-Recommendation

For a more comprehensive production line suitable for various consumer electronic products, the E-Team recommends combining the E by DEK with E by SIPLACE machines equipped with our ‘Collect-and-Place 14’ and ‘Collect-and-Place 12 – Pick-and-Place’ heads.

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Quality

The quality options for E by DEK
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The quality options for E by DEK was designed for all electronics manufacturers who want to optimize their paste application process for maximum print quality and stability.
Features

  • Paste-on-pad verification/li>
  • Advanced SPC software
  • Paste roll height monitor

E-Recommendation

The E-Team recommends combining the E by DEK with our E by SIPLACE machine equipped with the ‘Collect-and-Place 12 – Pick-and-Place’ head for a more reliable and versatile production line.

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Flexibility

Modules and flexible boards represent a major
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Modules and flexible boards represent a major trend in electronics production. With the E by DEK you can be a player in this business. The Modules Pack ensures stable printing processes thanks to special tooling and clamping systems.
Features

  • Flexible board printing
  • Edge clamp
  • Dual-speed motor (DSM)
  • Adjustable-width stencil sount (AWSM)
  • Semi-auto stencil load

E-Recommendation

The E-Team suggests pairing the E by DEK with our E by SIPLACE machine equipped with the ‘Collect & Place 14’ head for a fast and flexible production line.

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Long and heavy circuit boards

The E by DEK opens up new opportunities
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The E by DEK opens up new opportunities by letting you transport and print boards with lengths of up to 620 millimeters.
Features

  • 620 mm long board
  • Heavy-board rails
  • Remote board stop
  • Long-board understencil cleaner (USC) (600mm)

E-Recommendation

For a comprehensive mid-speed SMT line suitable for LED production, the E-Team recommends combining the E by DEK with our E by SIPLACE machine equipped with the ‘Collect-and-Place 12’ head.

E-Flexibility features:

  • Support for all major languages
  • Wide range of stencil sizes
  • Patented clamping systems

With its E-Flexibility, the E by DEK makes the printing process easy and stable. Intuitive multi-language user interfaces, clamping systems for a wide range of stencil sizes and a modular design deliver maximum flexibility.

The quickest way to get to know the E by DEK: Move your mouse over the green E-Hotspots.
Learn about the strengths and special features of this unique printing solution and find out why the E by DEK sets new standards in quality, performance and ease of operation.

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