- The Challenge – With rising demands from customers for better products, high changeover rate of products is unavoidable. This may in turn lead to line imbalance, decrease in utilization rate and change of heads due to the variety of component sizes required for different products. In the long run, these will bring disadvantages, especially for mid-speed segment manufacturers where standalone placement platforms are commonly used.
- The Strategy
The combination of the ‘Collect & Place’ (CP) and ‘Pick & Place’ (PP) principles resulted in the high speed and flexible E by SIPLACE Placement head – CP12/PP.
1. Maximized Line Utilization
The CP12 head is capable of collecting and placing components up to 18.7 x 18.7mm at a full high speed, with no compromises. While the PP head is able to handle components up to 45 x 98mm. Together, the best line balance will be resulted regardless of the type of product changeovers.
2. One Head for All Application
Having a full range capability allows the CP12 to place 01005 components with ease, becoming an all-rounder high speed chip shooter. As for the PP head, even components placement with size up to 45 x 98 x 19mm are possible and with accurate control placement force of up to 15N, all odd-shape components can be easily handled.
Suitable for all applications, with no head exchange necessary and best line utilization, the CP12/PP Flexible Placement Head brings the maximum real performance to customers.
To find out more, please click here to visit the E-Performance page or contact the E-Team via firstname.lastname@example.org .