- The Challenge – High speed, high accuracy and high first pass yield – are the key criteria that will come across manufacturers mind when it comes running the production line. However, many were challenged with the need to compromise speed and accuracy, especially in a high-product mix environment, where placement of very small components are required to be handled with special placement force (e.g. 01005 mass production). As a result, the first pass yield rate decreases.
- The Strategy
To tackle the need to compromise speed and accuracy, the E by SIPLACE CP14 High Speed Placement Head is equipped with features that ensure that having both speed and accuracy is possible.
1. Placement Quality
The CP14 is equipped with on-the-fly Vision System, which has the capability to take individual picture for each component. Together with the SIPLACE Standard – an integrated auto learning software for pick up position and PCB warpage, this ensures the quality of placement even at a high speed.
2. Small Component Placement
Especially for placement of smaller components, the rate of accuracy is a concern. With the individual placement force control, it adjusts the force accordingly for each component. In addition, the integrated component sensor will monitor the entire placement cycle (e.g. before/ after pick up and before/ after placement).
With these, the E by SIPLACE High Speed Placement Head – CP14 maintains high standards for speed and accuracy, an ideal solution for 01005 and fine pitch placement.
To find out more, please click here to visit the E-Performance page or contact the E-Team via firstname.lastname@example.org .